Scanning Acoustic Microscopy is an important technique used in failure analysis and quality inspection of semiconductor components. Scanning Acoustic Microscopy or (SAM), uses sound waves and their interactions with materials and materials interfaces to produce a waveform or image of the internal construction non-destructively. SAM primarily detects changes at interfaces, so these features are the primary ones in the image or waveform. Engineers use SAM to identify cracks, delaminations, voids, and placement of structures in complex packages.
Estimated Course Duration: 8