This course provides an overview of semiconductor testing, covering the entire process from initial wafer probe to final packaged part testing. We'll begin with an introduction to the fundamental concepts of testing and then delve into specific areas like parametric testing, wafer probe equipment, and package part testing methodologies. You'll gain a thorough understanding of Automatic Test Equipment (ATE), including the equipment used for wafer probing and the intricacies of probe cards. The course also covers electrical testing principles, with a special focus on power device testing. Finally, we'll explore methods for analyzing test data and discuss the critical considerations surrounding the cost of test in semiconductor manufacturing.
Estimated Course Duration: 4